Description
Features at a Glance
- Improved heat dissipation between the sensor and the mounting base
Technical Data
Mechanical Data
| Material | TGF-HSS-NS (silicone-free) |
| Thermal conductivity | 2,0 W/m K |
| Weight | 25 g |
General Data
| Packaging unit | 1 Piece |
| Material | TGF-HSS-NS (silicone-free) |
| Thermal conductivity | 2,0 W/m K |
| Weight | 25 g |
| Packaging unit | 1 Piece |